Thin Wall Packaging Academy
Digital Thin Wall Packaging Days 2027
09 – 12 March 2027 · 14:00 – 17:15 CET · 4 theme days
Programme 2027
Work in progress. Titles, speakers and times are placeholders and will be updated once speakers are confirmed. All presentations are held in English and last 20–25 minutes.
Day 1: General Thin Wall Packaging Market
Tuesday, 09 March 2027 · Opening, keynote and three technical presentations on the global thin wall packaging market: volumes, drivers, regulation and outlook.
Opening & welcome
Welcome, short introduction of the Thin Wall Packaging Academy, its goals and vision.
Thin Wall Packaging Academy · Host
30 min
Keynote: Thin Wall Packaging 2027 – market, material, future
A strategic opening keynote on where the thin wall packaging industry is heading in 2027 and beyond.
Keynote speaker (tbd) · Company tbd
30 min
Market figures & trends in Europe (placeholder title)
Current market volumes, growth drivers and key trends shaping the European thin wall packaging landscape.
Speaker 1 (tbd) · Company tbd
20–25 min
Break
Sustainability & regulation: PPWR in practice (placeholder title)
How the Packaging and Packaging Waste Regulation is reshaping design, recyclability and compliance.
Speaker 2 (tbd) · Company tbd
20–25 min
Materials & Recyclates in food packaging (placeholder title)
Material choices, recycled content and food-contact requirements for sustainable thin wall packaging.
Speaker 3 (tbd) · Company tbd
20–25 min
Q&A and closing of day 1
Moderation
45 min
Day 2: In Mould Labelling (IML) Day
Wednesday, 10 March 2027 · Six technical presentations on IML: label design, handling, automation, printing, quality assurance and recyclability. Each slot is presented by a speaker team from different companies.
Medical IML: New Frontier Beyond Classic Food Packaging
Exploring new medical application fields, emerging IML use cases, and how medical requirements differ from classic food packaging.
- Speaker 1a (tbd) · Company tbd
- Speaker 1b (tbd) · Company tbd
20–25 min
Label design for high cycle rates (placeholder title)
Optimising label geometry, material and static behaviour for fast, reliable high-cavity IML production.
- Speaker 2a (tbd) · Company tbd
- Speaker 2b (tbd) · Company tbd
20–25 min
Break
10 min
Automation & in-mould label handling (placeholder title)
Robotics, label magazines and process integration for efficient IML insertion and removal.
- Speaker 3a (tbd) · Company tbd
- Speaker 3b (tbd) · Company tbd
20–25 min
Quality Assurance in IML: Vision Systems, Scrap Sorting & Smart Inspection
Optical inspection basics, high-speed cavity rejection, handling complex label defects, and practical AI integration with real-world case studies.
- Speaker 4a (tbd) · Company tbd
- Speaker 4b (tbd) · Company tbd
20–25 min
Break
10 min
Thermoforming IML (IML-T): State of the Art, Decision Matrix & Case Studies
Evaluating technological maturity, key decision criteria for IML-T adoption, and real-world commercial success stories in thin-wall packaging.
- Speaker 5a (tbd) · Company tbd
- Speaker 5b (tbd) · Company tbd
20–25 min
Recyclability of IML packaging (placeholder title)
Designing IML packaging for recycling streams and meeting tomorrow's circular-economy targets.
- Speaker 6a (tbd) · Company tbd
- Speaker 6b (tbd) · Company tbd
20–25 min
Q&A and closing of day 2
Moderation
15 min
Day 3: Technology News in TWP I
Thursday, 11 March 2027 · Six technical presentations on injection moulding machines, tooling, hot runner technology and process monitoring. Each slot is presented by a speaker team from different companies.
Injection Compression Moulding (ICM): Technology, Trends & Process Comparison
State of the art in ICM, current market trends, and a direct technology comparison with conventional Injection Molding and Thermoforming.
- Speaker 1a (tbd) · Company tbd
- Speaker 1b (tbd) · Company tbd
20–25 min
ICM in Practice: Case Studies, Tooling Requirements & Deep Dive
Real-world case studies, mold design guidelines, process control parameters, and economic ROI analysis for high-speed ICM applications.
- Speaker 2a (tbd) · Company tbd
- Speaker 2b (tbd) · Company tbd
20–25 min
Break
10 min
Hot runner technology: what's new (placeholder title)
Recent advances in hot runner systems, nozzle technology and balanced filling for TWP applications.
- Speaker 3a (tbd) · Company tbd
- Speaker 3b (tbd) · Company tbd
20–25 min
Snus & Nicotine Pouch Packaging: High-Cavity Production & Market Insights
Navigating a booming market, technical challenges in multi-cavity tooling, barrier requirements, and real-world commercial case studies.
- Speaker 4a (tbd) · Company tbd
- Speaker 4b (tbd) · Company tbd
20–25 min
Break
10 min
Next-Gen Industrial Pails: Rezyklate, Co-Injection & Design for Recycling
Comparing industrial and food applications while tackling high PCR content, co-injection solutions, and mono-material handle trends under PPWR.
- Speaker 5a (tbd) · Company tbd
- Speaker 5b (tbd) · Company tbd
20–25 min
Energy efficiency in production (placeholder title)
Practical approaches to reducing energy consumption and CO₂ footprint in TWP manufacturing.
- Speaker 6a (tbd) · Company tbd
- Speaker 6b (tbd) · Company tbd
20–25 min
Q&A and closing of day 3
Moderation
15 min
Day 4: Technology News in TWP II
Friday, 12 March 2027 · Six technical presentations on automation, quality assurance, digitalisation, AI-supported production and outlook. Each slot is presented by a speaker team from different companies.
Chilled Coffee Packaging: Market Trends, Technologies & Customer Experience
European market overview, Injection Molding vs. Thermoforming, and the battle between 3D-contoured Sleeves and IML for premium shelf appeal.
- Speaker 1a (tbd) · Company tbd
- Speaker 1b (tbd) · Company tbd
20–25 min
Next-Gen Reusable Cups & Packaging Systems
Key insights into Stadium Cups, wash-stable labels, digital tracking (RFID) and technical requirements for high-cycle reuse loops.
- Speaker 2a (tbd) · Company tbd
- Speaker 2b (tbd) · Company tbd
20–25 min
Break
10 min
Digital twin in injection moulding (placeholder title)
How digital twins support simulation, setup, troubleshooting and predictive maintenance.
- Speaker 3a (tbd) · Company tbd
- Speaker 3b (tbd) · Company tbd
20–25 min
AI-supported process optimisation (placeholder title)
Machine learning and AI tools that turn process data into actionable quality improvements.
- Speaker 4a (tbd) · Company tbd
- Speaker 4b (tbd) · Company tbd
20–25 min
Break
10 min
Next-Gen Fibre Moulding: Technology Basics, Trends & Market Dynamics
Exploring fundamental technology principles, evaluating currently available market solutions, and tracking key innovation trends in molded fiber.
- Speaker 5a (tbd) · Company tbd
- Speaker 5b (tbd) · Company tbd
20–25 min
AI Chatbots for Molding & Thermoforming: Unlocking Engineering Know-How
How specialized AI agents accelerate packaging development, streamline quality evaluations, and empower engineers with real-time technical answers.
- Speaker 6a (tbd) · Company tbd
- Speaker 6b (tbd) · Company tbd
20–25 min
Closing words & farewell
Thin Wall Packaging Academy
15 min