Digital Thin Wall Packaging Days 2027

09 – 12 March 2027 · 14:00 – 17:15 CET · 4 theme days

Thin Wall Packaging Academy

Four days of compact expertise on thin wall packaging: market overview, In Mould Labelling and two days of technology news. All presentations are held in English and last 20–25 minutes, each followed by a Q&A. This draft contains placeholder content – programme and speakers will be added continuously.

Reserve a place (non-binding)View programme

Date

09 – 12 March 2027

Format

Online conference (live stream + recording)

Language

All presentations in English

The four theme days

An overview – detailed agenda in the programme

Day 1 · Tuesday, 09 March 2027

General Thin Wall Packaging Market

Opening, keynote and three technical presentations on the global thin wall packaging market: volumes, drivers, regulation and outlook.

Day 2 · Wednesday, 10 March 2027

In Mould Labelling (IML) Day

Six technical presentations on IML: label design, handling, automation, printing, quality assurance and recyclability. Each slot is presented by a speaker team from different companies.

Day 3 · Thursday, 11 March 2027

Technology News in TWP I

Six technical presentations on injection moulding machines, tooling, hot runner technology and process monitoring. Each slot is presented by a speaker team from different companies.

Day 4 · Friday, 12 March 2027

Technology News in TWP II

Six technical presentations on automation, quality assurance, digitalisation, AI-supported production and outlook. Each slot is presented by a speaker team from different companies.

Would you like to give a presentation?

Slots are still open for theme days 2 to 4. Submit your topic as a proposal – the academy's programme committee decides on acceptance. Presentations are in English.

Propose a presentation